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In all the 4 rounds, most of the questions were on my domain - TI DSP and Assembly Programming and a little bit of C. Every round went very well..in fact, one of the interviewer even had asked me when or how soon i can join!? Everything went on positive note.. But i'm still clueless about the final conclusion!! What has exactly happened?
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DSP Firmware Engineer

Interviewed at HARMAN

3.8
Jan 25, 2017

In all the 4 rounds, most of the questions were on my domain - TI DSP and Assembly Programming and a little bit of C. Every round went very well..in fact, one of the interviewer even had asked me when or how soon i can join!? Everything went on positive note.. But i'm still clueless about the final conclusion!! What has exactly happened?

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