No difficulty questions but all are tech questions. Very basic semiconductor principle questions, like what is n-type Si, NP junction reverse operation, fermi level...
Device Engineer Interview Questions
250 device engineer interview questions shared by candidates
CONTINUED HERE AS 5000 CHARACTERS LIMIT SIZE IN THE ABOVE COLUMN -------------------------TECHNICAL ROUND I -------------------------- (2 hours 45 min -very lengthy round i have ever had) Q1) Introduce yourself technically. Q2) Asked about my projects. Q3) Asked about my educational background. Q4) How will you proceed if the kernel source code that you downloaded does not support your board? What are the steps you will take? Q5) Write all the directories in linux that will be visible to you on your system and the directories of your kernel source code that you have downloaded. Differentiate between both. (Here he asked me whether I am sure of my answers that I wrote wherein I was too confused ) Q6) What is procfs ? What is the importance of procfs? Why it has got that name? Q7) What is sysfs ? Q8) What does /dev contain? Q9) How do you create node for a block device? Q10)How do you automatically get major number without using udev ? (He asked bcoz I answered udev will automatically update. He wants me to answer by not using udev functions) Q11)Can the same number be used for creating nodes for both char and block devices? Q12)Draw the block diagram for a char device driver implementation? (I explained about char device driver by writing all steps. He then asked me further questions ) Q13)Where file_operations have been used in registration? ( I answered cdev_init(my_cdev,&my_fops) and wrote all steps) Q14)What happens if you pass major number as 0 in register_chrdev_region()? Q15)Can you make your low-level driver directly interact with application without using core layer ? Is core layer mandatory? ( He asked me this question because I drew the block diagram for keyboard low-level driver with core layer and HLD) Q16)You have registered your file_operations with VFS layer. What about ISR routine and how will you register ? Q17)How your driver initialization will take place? What is the entry point for a driver? (I answered abt init and exit routines and drivers, modules and kernel service routines do not have pids. So they are invoked in process contexts. He then asked again questions) Q18)What is a PCB? Q19)What is a Stack section? Q20)How will be variables allocated in memory? How will you access heap? Q21)How many types of interrupts are there? (I answered software and hardware. I also said abt Bottom halves) Q22)What is the difference betw. various BHs and where do you apply? Q23)Is there any precaution for softirqs running simultaneously? Why and how do you solve? (I answered: applying synchronization techniques for shared access) Q24)Difference betw. various synchronization techinques and when do you need? Q25)Why semaphores are not used for ISRs? Q26)How do you implement threads? Q27)What is the basic difference betw. multiple processes and multiple child processes? Q28)Did you write any applications? ( I said no.) Q29)Write a small application to read 4 bytes and write 4 bytes for my device /dev/ttyS0. (As it was very simple. I wrote it and he then stopped as if he were satisied by my answers. A Very long interview!) -------------------------TECHNICAL ROUND II -------------------------- (30 min) Q1) Introduce about yourself and about your work so far. Q2) Questions on all my projects. Q3) Few questions about my background. Q4) How would you allocate memory in kernel? Q5) Write a data structure with integer and character as its elements. Q6) What is the size of this data structure? (I answered about structure padding as he was expecting the same answer from me) Q7) Allocate memory in heap by using the above data structure. How will you allocate then in stack? Q8) Initialize the above data structure. Implement a function by using which print the values of the data structure elements. Q9) Asked me to correct some logic about deleting a given node in linked list. Q10)Asked some personal questions and some discussion went on package ****** END OF INTERVIEW AT 4.24PM****** MOST DIFFICULT QUESTION: Comparison of the source code with the current kernel running on my system
do you have experience on TCAD simulation
1.describe semiconductor process flow. 2. explain latch-up. 3.defects types and cause
The Experience was nice, Basic questions of C programming and Some Questions Related to Windows Device Driver were asked
State Machine Diagram for a sequence
how to make an OS real time ? name few RTOSs how to make memcopy fast? code was written over board and had to identify problems in it like memory leak , accessing memory location which is not allocated
Describe DIBL and SCE
CMOS Parasitic capacitance
Shortly after the phone interview, the same VP sent me an email. She asked me to answer the questions in her email before bring me for an on-site interview. Here are the questions she asked me to answer: 1. How to get higher Psat and at same time to keep high gain? 2. How do you define tapered waveguide? 3. What is the disadvantage if the waveguide is tapered? 4. How to design the tapered waveguide? 5. Which parameters are limited the modulation speed? 6. What is "multi-contact device"? what is the benefit? 7. Why is VCSOA insensitive to the polarization of input signal? 8. How to design VCSOA? 9. How do you control the polarization sensitivity of an asymmetric structure of MQW SOA? 10. How to design QD SOA? What are the key parameters?
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