Apple Product Design Engineer, interview questions

1. Cantilever beam questions, how to improve stiffness of cantilever beam that holds apple logo in free end? name as many ways as you can. 2. Where the max deflection will happen? where point the stress is largest? 3. If you add extra stiffener, will you add it on top surface of the beam or bottom? 4. Which common injection molding defects you faced before? how you fix them? 5. four parts need to be made out from mold, where are the ideal positions for sprue, runner and gate? 6. which side should plastic inject from? core or cavity? 7. what's the difference between Cp and Cpk, which value indicates good tolerance control? 8. Name heat transfer modes. 9. Heat conduction question, know temperature, size, thermal conductivity of the heat source and thermal compound, calculate temperature on the other side. 10. Explain the definition of stress and strain?